Photothermal conversion LTHC coating LTHC INK, 18 kg_Electronic grade coatings_Product Center

RXRRT6BHF05S6OIF44C6_lthc-tbdb-process_R1

Photothermal conversion LTHC coating LTHC INK, 18 kg

Heat transfer fluid

The interface between the adhesive material and the glass carrier can be separated without stress and at room temperature using laser excitation
When using laser bonding, the glass and wafer front can be easily separated without stress at room temperature
Compatible with commonly used semiconductor reagents
No residual peeling
Used as part of the wafer support system

View details

Detailed Information

The photothermal conversion LTHC coating is a solvent based, spin on ink coating. A glass release coating specifically designed for temporary bonding and debonding of WSS wafers.

Photothermal conversion during temporary bonding and peeling processes

RXRRT6BHF05S6OIF44C6_lthc-tbdb-process_R1

A. Semiconductor wafer

B. UV curable adhesive LC-3200

C. Thermal Thermal Conversion Coating (LTHC)

D. Glass carrier

The photothermal conversion coating (LTHC) improves the efficiency of semiconductor wafer processing. It forms a coating between the glass carrier and the adhesive, converting light into heat during laser irradiation - which helps reduce the laser intensity required for peeling. This photothermal conversion can also achieve clean adhesive dissociation with minimal force at room temperature, maintaining the integrity of the glass carrier for reuse and recycling.

Specifications

Polymer Type

Thermoplastic Resin

Photothermal conversion LTHC coating LTHC INK, 18 kg

Navigation

Product

Contact Us

Follow us